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DescriptionResin Designs TP-2300 Thermal Gap Pad is a cost-competitive, highly compressible, silicone gel pad. pad. This filled gel pad delivers better-than-average bulk thermal properties and industry-leading thermal resistance in moderate-to-high heat flux applications. It is ideal for use to fill gaps between heat-generating components and related heat sinks, boards or chassis.
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Product Details
Tacky: 2 side Hardness,Shore 00: 65 max Compressio n Deflecti on at 20% psi: 25.6 Specific Gravity: 2.3 Thermal Conductivity W/m°k,min: 1.4 Tear Strength,0.5mm.thickness lb./in: - Weight Loss,after 336 hr.at 150°C,%: 1 max Volume Resistivity: 11 EXP 13 min UL 94 Rating/Cert File # QMFZ2.E177248: Thickness(mm):2.2-3.8 UV94:HB
Thickness(mm):4.6-5.0 UV94:V0
Storage: Because these are precured materials, there is no special storage condition or usage date required. The product should be stored in the original packaging under normal warehouse conditions to maintain the integrity of the packaging materials.
Applications: Switching devices, robotic automation power boards, and high kilowatt solar microinverters
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Ellsworth Adhesives Insights
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SDS / TDS
TDS TP-2300
