Design engineers are being asked to pack more functionality into smaller, more powerful electronic devices, while at the same time, maintain high reliability performance through thermal cycling, shock, vibration, and mechanical stress. As component sizes shrink and performance demands increase, underfill and edge bond materials have become essential tools for improving assembly robustness and extending product life.

Design engineers are being asked to pack more functionality into smaller, more powerful electronic devices, while at the same time, maintain high reliability performance through thermal cycling, shock, vibration, and mechanical stress. As component sizes shrink and performance demands increase, underfill and edge bond materials have become essential tools for improving assembly robustness and extending product life.

Designed for demanding industrial assemblies, 3M™ Scotch-Weld™ Structural Acrylic Adhesives deliver durable structural bonds across a wide range of materials. These adhesives can withstand extreme temperatures, apply easily, build strength rapidly and resist impact and peel stresses. Suitable for bonding plastics, aluminum, steel, and oily metal surfaces, they can also reduce reliance on mechanical fasteners in many applications.

Gain real-time insight into two-part adhesive dispensing with 3M™ Adhesive Mix Monitor. Help reduce scrap and rework, improve traceability, and support more consistent manufacturing processes.

Conformal coatings are just one method of circuit board protection available to engineers. Those involved with PCBs may be familiar with the terms encapsulation. Encapsulation is a tremendously powerful method to secure and protect PCBs by submerging them in a protective material.