Part number: EP1026 CLEAR B GLManufacturer SKU:
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DescriptionResinLab EP1026 Clear is a two component, room and elevated temperature curing, unfilled adhesive that is used for bonding plastics, metal, and ceramics. It is semi-rigid, free flowing, and resistant to salt spray, water, and most organic and inorganic solvents. 1:1 mix ratio. Part B, 1 gal Pail.
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Product Details
Typical Use: Designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free flowing in viscosity. It gives good resistance to water, salt spray, inorganic acids and bases, and most organic solvents. Chemical Composition: Epoxy hardener Color: Clear Components: 2 part Cure System: Room Temperature Cure Time: 24h @ room temperature Dielectric Strength: 410 V/mil Elongation: 10% to 20% @ break Flash Point: >93 °C Hardness: 85 D Mix Ratio: 1:1 by volume; 1:1 by weight Service Temperature: -40 to 90 °C Shear Strength: 2,500 Specific Gravity: Part B: 1.12; Mixed: 1.14 Tensile Strength: 7,500 psi Thermal Conductivity: 0.185 W/mK Viscosity: Part B: 15,000; Mixed: 15,500 Volume Resistivity: 8 x 10^14 ohm-cm Working Time: 3 to 5min -
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SDS / TDS
