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DescriptionHenkel Loctite Chipbonder 3609 is a heat curing epoxy adhesive designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. It is suited for applications where medium to high dispense speeds, high dot profile, high wet strength, and good electrical characteristics are required. 10 mL EFD Syringe.
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Product Details
Typical Use: Particularly suited for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. Chemical Composition: Epoxy Color: Red Components: 1 part Cure System: Heat Cure Time: 90 to 120s @ 150 °C Flash Point: >93 °C Shear Strength: >= 1,450 @ 150 °C Specific Gravity: 1.1 Thermal Conductivity: 0.4 W/mK Viscosity: 160 to 2,000 @ 25 °C Volume Resistivity: 2 x 10^15 ohm-cm -
SDS / TDS