Struggling with complex semiconductor packaging, overheating devices, or material failures?

Dow's silicone solutions, in partnership with Ellsworth Adhesives, offer a potential solution.

The persistent drive of smaller, faster, and more powerful electronic devices has pushed microelectronics packaging to its limits. Traditional materials like epoxies and polyurethanes are struggling to keep up with the demanding requirements ofadvanced packaging for technologies such as 5G, AI, and IoT.

Dow's Silicone Solutions offers a comprehensive portfolio of innovative silicone-based materials designed to overcome the limitations of traditional organic materials. Our silicone hotmelts, hybrids, and die-attach films deliver superior performance in critical areas:

• Exceptional Thermal Management: Silicone's inherent thermal conductivity efficiently dissipates heat, preventing device overheating and extending product life.

• Enhanced Reliability: Our silicone materials are engineered for outstanding durability, resistance to moisture, and long-term stability, ensuring consistent performance in demanding environments.

• Flexible Design Options: Dow's perse product range accommodates a wide range of packaging configurations, from simple to complex designs.

• Improved Processability: Our materials are designed for efficient production, reducing costs, and increasing yields.

Tailored Solutions for Your Needs

1) Die-Attach Films (DAF) Solutions: Precision and Accuracy (Find more info)

• Precise thickness control: Ensures consistent performance and reliability.

• Excellent uniformity: Eliminates defects like fillets and bleed-out.

• Ideal for sensing applications: Low modulus enables accurate data capture.

2) Hybrid Solutions: Enhanced Performance (Find more info) 

• Optimized mechanical properties: Combines the best of silicone and organic materials.

• Strong adhesion: Ensures long-lasting bond integrity.

• Versatility: Suitable for various packaging applications, including flip chip and optical devices.

3) Silicone Hotmelt Technologies: Flexibility and Efficiency (Find more info) 

• Versatile application methods: Choose from film, cartridge, or tablet formats.

• Stress relief: Mitigates warpage and improves product reliability.

• Efficient processing: Reduces production time and costs.

• Specific applications: 

   - Vacuum lamination: Ideal for flexible and coreless packaging.

   - Compression molding: Offers improved workability and thermal stability.

   - Transfer molding: Provides exceptional thermal stability for demanding applications.

By understanding your specific packaging challenges, Ellsworth Adhesives (the trusted authorized Dow’s distributor) can recommend the optimal silicone solution to meet your needs.

Contact Ellsworth Adhesives today to elevate your products!