Dymax Corporation expands its range of encapsulant materials with the introduction of Multi-Cure® 9037-F. The product cures in seconds upon exposure to UV/Visible light and has secondary heat cure for shadow areas caused by high-profile components on printed circuit boards.
Dymax Corporation, a leading manufacturer of rapid light-curing materials and equipment, introduces Low Shrink™ OP-81-LS epoxy that cures in seconds upon exposure to broad-spectrum light for fast, precise optical assembly.
The new LOCTITE® PC 9021 shock-absorbing backing material from Henkel has proven its ability to prolong the service life of gyratory and cone crushers throughout Europe. Now available in the UK, this supremely tough and flexible material minimises downtime and enhances productivity of machinery operating in the harshest of environments.
Protective gels for PCBs have been developed in recent years in response to many of the conditions noted earlier to solve unique problems in PCB reliability. These gels are in most cases based on the same or similar chemistry to traditional conformal coatings including acrylics, urethanes, and UV curable acrylated urethanes. HumiSeal® UV20GEL is a recent innovation from the polymer scientists at HumiSeal.
DOWSIL™ TC-3065 Thermally Conductive Gel is a recipient of the 2021 BIG Innovation Awards! The BIG Innovation Awards recognizes organizations, products and people that are bringing new ideas to life in innovative ways.