ResinLab EP965SC7 Epoxy Encapsulant Part B Clear 5 gal Pail
Part #: EP965SC7 CLEAR - B PL
Manufacturer SKU: EP965SC7 CLEAR B PL
ResinLab EP965SC7 Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part B, 5 gal Pail.