Resin Designs Epoxy Hybrid Polymer 131-77MX
Part #: Epoxy Hybrid Polymer 131-77MX
Manufacturer SKU:
Hybrid Polymer 131-77MX is a transparent, room temperature curing, two-part, epoxy-based system designed to encapsulate small to medium-sized electronic packages. This product provides excellent moisture, chemical, and physical shock resistance properties, ideal for protection against harsh environments. Hybrid Polymer 131-77MX also bonds readily to polycarbonate, nylon, and metal, making it a supreme choice for electronics encapsulation.